1. Electromigration of eutectic SnPb and SnAg3.8Cu0.7 flip chip solder bumps and under-bump metallization;Lee;Journal of Applied Physics,2001
2. Electromigration of eutectic SnPb solder interconnects for flip chip technology;Lee;Journal of Applied Physics,2001
3. Liu, X., Lu, G.-Q., 2001. D2BGA Chip-Scale IGBT Package. In: Proceedings of 16th Annual IEEE Applied Power Electronics Conference and Exposition, Anaheim, California, 2001
4. Liu, X., Calata, J.N., Wang, J., Lu, G.-Q., 1999. The Packaging of Integrated Power Electronics Modules Using Flip-Chip Technology. CPES Seminar, 1999
5. Liu, X., Jing, X., Lu, G.-Q., 2000. A comparative study of wire bonding versus solder bumping of power semiconductor devices. In: 2000 IEEE (IWIPP), Boston, MA, 2000