A thermodynamics based damage mechanics constitutive model for low cycle fatigue analysis of microelectronics solder joints incorporating size effects-Reference-Cited by-同舟云学术

A thermodynamics based damage mechanics constitutive model for low cycle fatigue analysis of microelectronics solder joints incorporating size effects

Published:2005-06 Issue:13 Volume:42 Page:3744-3772
ISSN:0020-7683
Container-title:International Journal of Solids and Structures
language:en
Short-container-title:International Journal of Solids and Structures

Author:

Gomez Juan,Basaran Cemal

Publisher

Elsevier BV

Subject

Applied Mathematics,Mechanical Engineering,Mechanics of Materials,Condensed Matter Physics,General Materials Science,Modelling and Simulation

Reference40 articles.

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3. Plastic indentation in metals with cones;Atkins;J. Mech. Phys. Solids,1965

4. Basaran, C., Tang, H., 2002. Implementation of a thermodynamic framework for damage mechanics of solder interconnect in microelectronic packaging. Proceedings of IMECE, 2002 ASME International Mechanical Engineering Congress and Exposition. New Orleans, LA

5. A Thermodynamic framework for damage mechanics of solder joints;Basaran;J. Electron. Packag. Trans. ASME,1998

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