Author:
Chi Qingguo,Zhang Xinle,Wang Xubin,Zhang Changhai,Zhang Yongquan,Tang Chao,Li Zhonghua,Zhang Tiandong
Subject
Materials Chemistry,Polymers and Plastics,Mechanics of Materials,Ceramics and Composites
Reference32 articles.
1. A review of SiC power module packaging technologies: challenges, advances, and emerging issues;Lee;Ieee.J. Emerg.Sel. Top.Power Electron.,2020
2. Novel micro-nano epoxy composites for electronic packaging application: balance of thermal conductivity and processability;Hu;Compos. Sci. Technol.,2021
3. Hierarchically multifunctional polyimide composite films with strongly enhanced thermal conductivity;Guo;Nano-Micro Lett.,2021
4. Multifunctional Ti3C2Tx-(Fe3O4/polyimide) composite films with Janus structure for outstanding electromagnetic interference shielding and superior visual thermal management;Zhang;Nano Res.,2022
5. Study of the synergistic effect of boron nitride and carbon nanotubes in the improvement of thermal conductivity of epoxy composites;Isarn;Polym. Int.,2019
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