High thermal conductivity and low dielectric loss of three-dimensional boron nitride nanosheets/epoxy composites

Author:

Zhang Tiandong,Wang Chenghai,Liu Gang,Yao Cheng,Zhang Xinle,Zhang Changhai,Chi Qingguo

Publisher

Elsevier BV

Reference38 articles.

1. Advances on thermally conductive epoxy‐based composites as electronic packaging underfill materials—a review;Wen;Adv. Mater.,2022

2. Preparation of noncovalent functionalized Boron Nitride and its 3D collaborative thermal conduction network with epoxy;Cao;Surface. Interfac.,2022

3. Novel micro-nano epoxy composites for electronic packaging application: balance of thermal conductivity and processability;Hu;Compos. Sci. Technol.,2021

4. A full-component recyclable epoxy/BN thermal interface material with anisotropy high thermal conductivity and interface adaptability;Liu;Chem. Eng. J.,2023

5. A novel three-dimensional boron phosphide network for thermal management of epoxy composites;He;Compos. B Eng.,2022

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