Mechanical and functional properties of polyamide/graphene nanocomposite prepared by chemicals free-approach and selective laser sintering
Author:
Funder
National Natural Science Foundation of China
Publisher
Elsevier BV
Subject
Materials Chemistry,Polymers and Plastics,Mechanics of Materials,Ceramics and Composites
Reference45 articles.
1. Recent progress in thermally conductive polymer/boron nitride composites by constructing three-dimensional networks;Bai;Compos. Commun.,2021
2. Mechanical, toughness and thermal properties of 2D material- reinforced epoxy composites;Han;Polymer,2019
3. A facile way to prepare phosphorus-nitrogen-functionalized graphene oxide for enhancing the flame retardancy of epoxy resin;Fang;Compos. Commun.,2018
4. Striking effect of nanosized carbon black modified by grafting sodium sulfonate on improving the flame retardancy of polycarbonate;Yu;Compos. Commun.,2020
5. The rise of graphene;Geim,2010
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