Reach on the preparation process of diamond/SiC composites with bimodal diamond particle
Author:
Funder
National Natural Science Foundation of China
Publisher
Elsevier BV
Subject
Materials Chemistry,Polymers and Plastics,Mechanics of Materials,Ceramics and Composites
Reference23 articles.
1. Advances in composite materials for thermal management in electronic packaging;Zweben;J. Occup. Med.,1998
2. Thermal expansion behaviour and dimensional stability of Diamond/Cu composites with different diamond content;Xie;J. Alloys Compd.,2019
3. Fabrication and thermal conductivity of near-net-shaped diamond/copper composites by pressureless infiltration;Dong;J. Mater. Sci.,2011
4. Tailoring interfacial bonding states of highly thermal performance diamond/Al composites: spark plasma sintering vs. vacuum hot pressing;Tan;Compos. Appl. Sci. Manuf.,2016
5. Effect of (0-40) wt. % Si addition to Al on the thermal conductivity and thermal expansion of diamond/Al composites by pressure infiltration;Guo;J. Alloys Compd.,2016
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