Effects of nitrilotriacetic acid and corrosion inhibitor on cobalt barrier chemical–mechanical polishing: Experimental and density functional theory analysis-Reference-Cited by-同舟云学术

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Effects of nitrilotriacetic acid and corrosion inhibitor on cobalt barrier chemical–mechanical polishing: Experimental and density functional theory analysis

Published:2020-11 Issue: Volume:605 Page:125392
ISSN:0927-7757
Container-title:Colloids and Surfaces A: Physicochemical and Engineering Aspects
language:en
Short-container-title:Colloids and Surfaces A: Physicochemical and Engineering Aspects

Author:

Zhang Xinbo,Pan Guofeng,Hu Lianjun,Wang Hao,Wang Chenwei

Funder

Major National Science and Technology Special Projects

National Natural Science Foundation of Hebei province

Key Project of Natural Science of Hebei Province Colleges and Universities

Key Laboratory of Electronic Materials and Devices of Tianjin, China

Publisher

Elsevier BV

Subject

Colloid and Surface Chemistry

Reference84 articles.

1. Chemical processes in the chemical mechanical polishing of copper;Steigerwald;Mater. Chem. Phys.,1995

2. Comparative study of copper films prepared by ionized metal plasma sputtering and chemical vapor deposition in the Cu/TaN/SiO2/Si multilayer structure;Latt;J. Mater. Sci.,2001

3. 2 – Copper chemical mechanical planarization (Cu CMP) challenges in 22 nm back-end-of-line (BEOL) and beyond;Krishnan,2016

4. Pulsed galvanostatic electrodeposition of copper on cobalt using a pH-neutral plating bath and electroless seeds;Simpson;J. Electrochem. Soc.,2018

5. The effect of inhibitors on Co corrosion in alkaline post Cu-CMP cleaning solutions;Hsu;Solid State Phenom.,2016

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