Role of interparticle forces during stress-induced agglomeration of CMP slurries
Author:
Publisher
Elsevier BV
Subject
Colloid and Surface Chemistry
Reference18 articles.
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2. Foundations of Colloid Science;Hunter,2001
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4. Enhanced tungsten chemical mechanical polishing using stable alumina slurries;Bielmann;Electrochem. Solid State Lett.,1999
5. Effect of slurry ionic salts at dielectric silica CMP;Choi;J. Electrochem. Soc.,2004
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