1. R.K. Iler, The Chemistry of Silica, Solubility, Polymerization, Colloid and Surface Properties, and Biochemistry, Wiley-Interscience, New York, 1979.
2. E. Dorre, Alumina: processing properties and applications, Materials Research and Engineering, vol. 3, Springer Verlag, New York, 1985.
3. Chemical–mechanical polishing of copper and tantalum with silica abrasives;Li;J. Mater. Res.,2001
4. The role of alumina particle density in the chemical–mechanical polishing of copper, tantalum and tungsten disks and films, IMIC;Ramarajan;J. CMP ULSI Multilevel Interconnection,1999
5. Measuring particle size by light scattering;Borkovec,2001