Glancing angle EXAFS studies of Cu-Al thin film interfaces
Author:
Publisher
Elsevier BV
Subject
Electrical and Electronic Engineering,Condensed Matter Physics,Electronic, Optical and Magnetic Materials
Reference4 articles.
1. Proc. of Mat. Res. Soc.;Chen,1986
2. Glancing-angle extended x-ray-absorption fine structure and reflectivity studies of interfacial regions
3. H. Chen and S. M. Heald, Ionic Solids, in press
4. A study of the initial growth kinetics of the copper‐aluminum thin‐film interface reaction by in situ x‐ray diffraction and Rutherford backscattering analysis
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1. Structurally complex metallic coatings in the Al-Cu system and their orientation relationships with an icosahedral quasicrystal;Journal of Materials Research;2010-04
2. How aluminum bonds to a copper 100 surface;Journal of Physics and Chemistry of Solids;1993-08
3. Bonding at Cu-Al interfaces: Relevance to microcircuit packaging;Journal of Physics and Chemistry of Solids;1992-02
4. EXAFS at grazing incidence: Data collection and analysis;Review of Scientific Instruments;1992-01
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