Thermal diffusivity measurement of low-k dielectric thin film by temperature wave analysis
Author:
Publisher
Elsevier BV
Subject
Physical and Theoretical Chemistry,Condensed Matter Physics,Instrumentation
Reference40 articles.
1. Thermal diffusivity measurement of polymer films by the temperature wave method using joule-heating
2. T. Hashimoto, Data Book of Thermal Diffusivity of Polymers, 1994.
3. Study of change in thermal diffusivity of amorphous polymers during glass transition
4. Thermal diffusivity of thermosetting materials by temperature-wave analysis
5. Measurement of the thermal diffusivity of thin films by an AC joule-heating method
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