Vapor pressure, kinetics and enthalpy of sublimation of bis(2,2,6,6-tetramethyl-3,5-heptanedionato)copper(II)
Author:
Publisher
Elsevier BV
Subject
Physical and Theoretical Chemistry,Condensed Matter Physics,Instrumentation
Reference19 articles.
1. Advanced multilayer metallization schemes with copper as interconnection metal
2. A new metallization technique for very large scale integrated structures: Experiments and computer simulation
3. Thermodynamic investigation of the MOCVD of copper films frombis(2,2,6,6-tetramethyl-3,5-heptadionato)copper(II)
4. Copper thin films prepared by chemical vapour deposition from copper dipivalylmethanate
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1. Low-Temperature Thermodynamic Properties of Cu(C11H19O2)2: A Universal Description of the Heat Capacity of Metal Dipivaloylmethanates;Russian Journal of Physical Chemistry A;2024-09
2. Synthesis, crystal structure, thermal properties of a homoleptic Schiff base cobalt complex bis(N-tert-pentyl salicylaldimine)cobalt(II) as precursor for coating Co3O4 thin film by a plasma enhanced MOCVD;Inorganica Chimica Acta;2024-01
3. Synthesis, Crystal Structure, Thermal Properties of a Homoleptic Schiff's Base Cobalt Complex Bis (N-Tert-Pentyl Salicylaldimine)Co(Ii) as Precursor for Coating Co3o4 Thin Film by a Plasma Enhanced Mocvd;2023
4. Study of Monomeric Copper Complexes Supported by N-Heterocyclic and Acyclic Diamino Carbenes;Organometallics;2017-06-29
5. Phase Transition Enthalpy Measurements of Organic and Organometallic Compounds and Ionic Liquids. Sublimation, Vaporization, and Fusion Enthalpies from 1880 to 2015. Part 2. C11–C192;Journal of Physical and Chemical Reference Data;2017-03
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