Thermodynamic description of the Ag–Bi–Sb system

Author:

Liu Jinming,Guo Cuiping,Li Changrong,Du Zhenmin

Publisher

Elsevier BV

Subject

Physical and Theoretical Chemistry,Condensed Matter Physics,Instrumentation

Reference23 articles.

1. Proceeding of Surface Mount International Conference;Allenby,1992

2. Reliability of Sn–Ag–Sb lead-free solder joints;Lee;Mater. Sci. Eng. A,2005

3. Effect of Ag and Ni on the melting point and solder ability of SnSbCu solder alloys;Yan;Int. J. Miner. Met. Mater.,2009

4. The thermodynamic properties of the moderately dilute liquid solutions of copper silver, and gold in thallium, lead, and bismuth;Kleppa;J. Phys. Chem.,1956

5. Bismuth alloys. I. Liquidus curves of the bismuth–copper bismuth–silver, and bismuth–gold systems;Nathans;J. Phys. Chem.,1962

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