A study of Ni 3 Sn 4 growth dynamics in Ni-Sn TLPS bonding process by differential scanning calorimetry-Reference-Cited by-同舟云学术

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A study of Ni 3 Sn 4 growth dynamics in Ni-Sn TLPS bonding process by differential scanning calorimetry

Published:2018-05 Issue: Volume:663 Page:53-57
ISSN:0040-6031
Container-title:Thermochimica Acta
language:en
Short-container-title:Thermochimica Acta

Author:

Feng Hongliang,Huang Jihua,Peng Xianwen,Lv Zhiwei,Wang Yue,Yang Jian,Chen Shuhai,Zhao Xingke

Funder

National Nature Science Foundation of China

Publisher

Elsevier BV

Subject

Physical and Theoretical Chemistry,Condensed Matter Physics,Instrumentation

Reference19 articles.

1. A Monolithic, 500 °C Operational Amplifier in 4H-SiC Bipolar Technology

2. Investigation of the reliability of 4H–SiC MOS devices for high temperature applications

3. A Review on Die Attach Materials for SiC-Based High-Temperature Power Devices

4. InAlN/GaN HEMTs for Operation in the 1000 $^{\circ} \hbox{C}$ Regime: A First Experiment

5. Strength of joints produced by transient liquid phase bonding in the Cu–Sn system

Cited by 10 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Exceptional load-bearing capability of Al FPCB/Cu FPCB lap joints using instantaneous laser-based large area facial soldering: Experimental and numerical investigations;Journal of Materials Research and Technology;2024-05

2. Tailoring thermal behavior and solid–liquid contact area of Sn/Cu composite solder during ultrasonic-assisted transient liquid phase process;Journal of Materials Science: Materials in Electronics;2023-01

3. Precipitation transformation and strengthening mechanism of droplet ejection lightweight medium-entropy AlZnMgCuLi alloy;Journal of Alloys and Compounds;2022-11

4. Study on the Kinetics of Ni3Sn4 Growth and Isothermal Solidification in Ni-Sn TLPS Bonding Process;Metallurgical and Materials Transactions A;2022-02-27

5. Research on Ni₃Sn₄ intermetallic compound for 5μm diameter Cu/Ni/Sn-3.0Ag micro bumps;IEICE Electronics Express;2022-01-25

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