1. H. Lin, A.J. Walton, C.C. Dunare, J.T.M. Stevenson, A.M. Gundlach, S. Smith, A.S. Bunting, in: Proceedings of the IEEE International Conference on Microelectronic Test Structures, 2006, pp. 143–148.
2. D.J. Bennett, A. O’Hara, I. Underwood, A.J. Walton, in: Proceedings of the IEEE International Conference on Microelectronic Test Structures, 1997, pp. 11–15.
3. H. Lin, Ph.D. thesis, University of Edinburgh, 2007.
4. Contact Resistance Measurement of Bonded Copper Interconnects for Three-Dimensional Integration Technology
5. Low-temperature thermal oxide to plasma-enhanced chemical vapor deposition oxide wafer bonding for thin-film transfer application