1. A. Witvrouw, CMOS–MEMS integration: why, how and what, Proc. IEEE/ACM Int. Conf. on Computer-aided Design, San Jose, USA, 5–9 (2006) 826–827.
2. H. Baltes, A. Hierlemann, D. Kange, C. Hagleitner, CMOS MEMS – present and future, Proc. 15th Int. Conf. Micro Electro Mechanical Systems 2002 (MEMS 2002), Las Vegas, USA, 20–24 (2002) 459–466..
3. A.W. Topol, B.K. Furman, K.W. Guarini, L. Shi, G.M. Cohen, G.F. Walker, Enabling technologies for wafer-level bonding of 3D MEMS and integrated circuit structures, Proc. 54th Electronic Components and Technology Conf. (ECTC 2004), Las Vegas, USA, 1–4 (2004) 931–938.
4. Wafer-Level Heterogeneous Integration for MOEMS, MEMS, and NEMS
5. Wafer level packaging of MEMS