Thermo-mechanical analysis and interfacial energy release rate estimation for metal–insulator–metal capacitor device-Reference-Cited by-同舟云学术

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Thermo-mechanical analysis and interfacial energy release rate estimation for metal–insulator–metal capacitor device

Published:2011-05 Issue:5 Volume:88 Page:779-784
ISSN:0167-9317
Container-title:Microelectronic Engineering
language:en
Short-container-title:Microelectronic Engineering

Author:

Hsieh Ming-Che,Wu Sheng-Tsai,Tain Ra-Min,Chen Chao-Huang,Lin Cheng-Kuo

Publisher

Elsevier BV

Subject

Electrical and Electronic Engineering,Surfaces, Coatings and Films,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials

Reference11 articles.

1. Silicon based system in package: Improvement of passive integration process to avoid TBMS failure

2. S. Demirtas et al., Lifetime estimation of intrinsic silicon nitride MIM capacitors in a GaN MMIC process, in: International Conference on Compound Semiconductor Manufacturing Technology, Tampa, FL, USA, 2009.

3. Adhesion and debonding of multi-layer thin film structures

4. Optimizing the precision of the four-point bend test for the measurement of thin film adhesion

5. A Test Specimen for Determining the Fracture Resistance of Bimaterial Interfaces

Cited by 1 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Energy Release Rate Estimation for Through Silicon Vias in 3-D IC Integration;IEEE Transactions on Components, Packaging and Manufacturing Technology;2014-01

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