Wafer level silicon mould fabrication and imprinting of high density microstructures-Reference-Cited by-同舟云学术

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Wafer level silicon mould fabrication and imprinting of high density microstructures

Published:2013-04 Issue: Volume:104 Page:64-68
ISSN:0167-9317
Container-title:Microelectronic Engineering
language:en
Short-container-title:Microelectronic Engineering

Author:

Wong T.I.,Ong H.Y.,Lu H.J.,Tse M.S.,Quan C.G.,Ng S.H.,Zhou X.

Publisher

Elsevier BV

Subject

Electrical and Electronic Engineering,Surfaces, Coatings and Films,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials

Reference21 articles.

1. New Approaches to Nanofabrication: Molding, Printing, and Other Techniques

2. Nanoimprint lithography

3. Imprint of sub‐25 nm vias and trenches in polymers

4. Imprint Lithography with 25-Nanometer Resolution

5. Roller nanoimprint lithography

Cited by 2 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Single-step deep reactive ion etching of ultra-deep silicon cavities with smooth sidewalls;Sensors and Actuators A: Physical;2014-02

2. High throughput and high yield nanofabrication of precisely designed gold nanohole arrays for fluorescence enhanced detection of biomarkers;Lab on a Chip;2013

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