Electroless deposition of CoWP: Material characterization and process optimization on 300mm wafers-Reference-Cited by-同舟云学术

Electroless deposition of CoWP: Material characterization and process optimization on 300mm wafers

Published:2006-11 Issue:11-12 Volume:83 Page:2082-2087
ISSN:0167-9317
Container-title:Microelectronic Engineering
language:en
Short-container-title:Microelectronic Engineering

Author:

Decorps T.,Haumesser P.H.,Olivier S.,Roule A.,Joulaud M.,Pollet O.,Avale X.,Passemard G.

Publisher

Elsevier BV

Subject

Electrical and Electronic Engineering,Surfaces, Coatings and Films,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials

Reference9 articles.

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3. A. Zylbermann, Y. Sverdlov, Y. Shacham-Diamand, in: Proceedings of Advanced Metallization Conference (AMC 2002), (2003) pp. 767–773.

4. T. Decorps, P.H. Haumesser, C. Peyne, M. Cordeau, F. Raynal, P. Rabinzohn, C. Bureau, in: Proceedings of Advanced Metallization Conference (AMC 2004), (2005) pp. 823–829.

5. Electroless Plating: Fundamentals and Applications;Mallory,1990

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5. Bibliography;Nucleation and Growth of Metals;2016