28 nm pitch of line/space pattern transfer into silicon substrates with chemo-epitaxy Directed Self-Assembly (DSA) process flow-Reference-Cited by-同舟云学术

28 nm pitch of line/space pattern transfer into silicon substrates with chemo-epitaxy Directed Self-Assembly (DSA) process flow

Published:2014-07 Issue: Volume:123 Page:180-186
ISSN:0167-9317
Container-title:Microelectronic Engineering
language:en
Short-container-title:Microelectronic Engineering

Author:

Chan Boon Teik,Tahara Shigeru,Parnell Doni,Rincon Delgadillo Paulina A.,Gronheid Roel,de Marneffe Jean-François,Xu Kaidong,Nishimura Eiichi,Boullart Werner

Funder

European Union’s Seventh Framework Programme FP7/2007–2013

Publisher

Elsevier BV

Subject

Electrical and Electronic Engineering,Surfaces, Coatings and Films,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials

Reference15 articles.

1. Makoto Muramatsu et al., Proc. SPIE (2011).

2. Dry Etch Resistance of Organic Materials

3. Benjamen Rathsack et al., Proc. SPIE (2012).

4. Implementation of a chemo-epitaxy flow for directed self-assembly on 300-mm wafer processing equipment

Cited by 16 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Nanofabrication by Self-Assembly;Nanofabrication;2024

2. Sequential Brush Grafting for Chemically and Dimensionally Tolerant Directed Self-Assembly of Block Copolymers;ACS Applied Materials & Interfaces;2022-12-19

3. Self-Aligned Assembly of a Poly(2-vinylpyridine)-b-Polystyrene-b-Poly(2-vinylpyridine) Triblock Copolymer on Graphene Nanoribbons;ACS Applied Materials & Interfaces;2021-08-17

4. Selective plasma etching of silicon-containing high chi block copolymer for directed self-assembly (DSA) application;Journal of Vacuum Science & Technology B;2021-07

5. Resist-Free Directed Self-Assembly Chemo-Epitaxy Approach for Line/Space Patterning;Nanomaterials;2020-12-07