Author:
Marinov Val R.,Swenson Orven,Atanasov Yuriy,Schneck Nathan
Subject
Electrical and Electronic Engineering,Surfaces, Coatings and Films,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials
Reference38 articles.
1. Why are silicon wafers as thick as they are?;Stallhofer,2011
2. Ultra-thin electronic device package
3. System-in-foil technology;Dietzel,2011
4. Ultra-thin Chip Technology and Applications;Burghartz,2010
5. Thin chips for flexible and 3D-integrated electronic systems;Bock,2003
Cited by
44 articles.
订阅此论文施引文献
订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献