Bond pad surface quality for reliable wire bonding-Reference-Cited by-同舟云学术

Bond pad surface quality for reliable wire bonding

Published:2011-12 Issue:12 Volume:88 Page:3452-3458
ISSN:0167-9317
Container-title:Microelectronic Engineering
language:en
Short-container-title:Microelectronic Engineering

Author:

Knotter D. Martin,Rink Ingrid A.,Claassen Wim A.P.,Philipsen Jos H.M.

Publisher

Elsevier BV

Subject

Electrical and Electronic Engineering,Surfaces, Coatings and Films,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials

Reference6 articles.

1. Surface treatment of wire bonding metal pads

2. Automotive Electronics Council, AEC-Q100-ref-F, 2003.

3. M. Petzold, L. Berthold, D. Katzer, H. Knoll, D. Memhard, P. Meier, K.D. Lang, in: Proceedings of 3rd International Conference and Exhibition Micro Materials (MicroMat 2000), Berlin (Germany), Goldenbogen (Dresden), 2000, pp. 434–437.

4. P.G. Sheasby, R. Pinner, in: The Surface Treatment and Finishing of Aluminum and Its Alloys, sixth ed., Finishing Publications Ltd & ASM International, USA & UK, 2001.

5. Growth kinetics and mechanisms of aluminum-oxide films formed by thermal oxidation of aluminum

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