Investigations regarding Through Silicon Via filling for 3D integration by Periodic Pulse Reverse plating with and without additives-Reference-Cited by-同舟云学术

Investigations regarding Through Silicon Via filling for 3D integration by Periodic Pulse Reverse plating with and without additives

Published:2011-05 Issue:5 Volume:88 Page:705-708
ISSN:0167-9317
Container-title:Microelectronic Engineering
language:en
Short-container-title:Microelectronic Engineering

Author:

Hofmann Lutz,Ecke Ramona,Schulz Stefan E.,Gessner Thomas

Publisher

Elsevier BV

Subject

Electrical and Electronic Engineering,Surfaces, Coatings and Films,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials

Reference7 articles.

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