Author:
Tang Zirong,Shi Tielin,Liao Guanglan,Liu Shiyuan
Subject
Electrical and Electronic Engineering,Surfaces, Coatings and Films,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials
Reference12 articles.
1. Semiconductor Wafer Bonding: Science and Technology;Tong,1999
2. Self‐propagating room‐temperature silicon wafer bonding in ultrahigh vacuum
3. Surface energy and the contact of elastic solids
4. S. Farrens, J. Dekker, in: Proceedings of the Third International Symposium on Semiconductor Wafer Bonding: Physics and Applications, Reno, NV, 1995, p. 184.
5. The influence of wafer dimensions on the contact wave velocity in silicon wafer bonding
Cited by
18 articles.
订阅此论文施引文献
订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献