Author:
Chen Guanhua 陈观华,Xiao Pulu 肖蒲庐,Zhang Xiang 张翔,Chen Yu 陈宇,Yuan Xiao 袁孝
Publisher
Shanghai Institute of Optics and Fine Mechanics
Subject
Electrical and Electronic Engineering,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials
Reference39 articles.
1. Development of through glass tungsten via interconnect for 3D MEMS packaging;Y Sun,2011
2. Bonding of optical materials by femtosecond laser welding for aerospace and high power laser applications;D Hélie;Proceedings of SPIE,2012
3. Effective cleaning process and its influence on surface roughness in anodic bonding for semiconductor device packaging;R Joyce;Materials Science in Semiconductor Processing,2015
4. Automated laser-based glass fusing with powder additive;L Pohl;ICALEO,2014
5. Laser welding of glasses using a nanosecond pulsed Nd∶YAG laser;A de Pablos-Martín;Optics and Lasers in Engineering,2017
Cited by
1 articles.
订阅此论文施引文献
订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献