Filling behavior of UV nanoimprint resin observed by using a midair structure mold-Reference-Cited by-同舟云学术

Filling behavior of UV nanoimprint resin observed by using a midair structure mold

Published:2009-04 Issue:4-6 Volume:86 Page:676-680
ISSN:0167-9317
Container-title:Microelectronic Engineering
language:en
Short-container-title:Microelectronic Engineering

Author:

Taniguchi Jun,Machinaga Ken-ichi,Unno Noriyuki,Sakai Nobuji

Publisher

Elsevier BV

Subject

Electrical and Electronic Engineering,Surfaces, Coatings and Films,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials

Reference4 articles.

1. Fabrication of three-dimensional nanoimprint mold using inorganic resist in low accelerating voltage electron beam lithography

2. Sub-100-nm three-dimensional nanoimprint lithography

3. Microfluidic Networks for Chemical Patterning of Substrates: Design and Application to Bioassays

4. Fabrication of Three-Dimensional Hydrogen Silsesquioxane Resist Structure using Electron Beam Lithography

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