Author:
Zhang W.,Song C.,Xue K.,Yang S.,Yong Z.,Li H.,Xue H.,Jing X.,Lee U.
Funder
National Science & Technology Major Project
Subject
Electrical and Electronic Engineering,Surfaces, Coatings and Films,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials
Reference22 articles.
1. Through-silicon via and die stacking technologies for microsystems-integration;Beyne,2008
2. Through silicon via technology-processes and reliability for wafer-level 3D system integration;Ramm,2008
3. Study of the Au/In reaction for transient liquid-phase bonding and 3D chip stacking;Zhang;J. Electron. Mater.,2008
4. 3D silicon integration;Knickerbocker,2008
5. Formation of TSV for the stacking of advanced logic devices utilizing bumpless wafer-on-wafer technology;Diehl;Microelectron. Eng.,2012
Cited by
10 articles.
订阅此论文施引文献
订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献