Author:
Morgan Brian,Hua Xuefeng,Iguchi Tomohiro,Tomioka Taizo,Oehrlein Gottlieb S.,Ghodssi Reza
Subject
Electrical and Electronic Engineering,Surfaces, Coatings and Films,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials
Reference19 articles.
1. Process compatible polysilicon-based electrical through-wafer interconnects in silicon substrates
2. R.A. Lee, W.A. Moreno, R.A. Gassman, D. Miller, in: Proceedings of 1992 13th IEEE/CHMT International Electronic Manufacturing Symposium, Baltimore, MD, 28–30 September, 1992
3. A Plated Through‐Hole Interconnect Technology in Silicon
4. Through-wafer copper electroplating for three-dimensional interconnects
5. S. Spiesshoefer, L. Schaper, S. Burkett, G. Vangara, Z. Rahman, P. Arunasalam, in: 2004 Electronic Components and Technology Conference, 2004, pp. 466–471
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