Overview of dual damascene integration schemes in Cu BEOL integration
Author:
Publisher
Elsevier BV
Subject
Electrical and Electronic Engineering,Surfaces, Coatings and Films,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials
Reference12 articles.
1. C. Vérove et al., in: IITC, 2000, p. 267ff.
2. W. Cote et al., in: AMC, 2007.
3. T.J. Dalton et al., in: AMC, 2004, pp. 85-89.
4. V. McGahay et al., in: ULSI, 2002, pp. 3–9.
5. O. Hinsinger et al., in: IEDM, 2004, pp. 317–320.
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