Author:
Stangl M.,Acker J.,Oswald S.,Uhlemann M.,Gemming T.,Baunack S.,Wetzig K.
Subject
Electrical and Electronic Engineering,Surfaces, Coatings and Films,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials
Reference34 articles.
1. T. Nogami, A. Preusse, V. Dubin, Apparatus for forming a copper interconnect, Patent No. US 6,106,680 A (2000).
2. Metal Based Thin Films for Electronics;Wetzig,2006
3. Theoretical investigation of sulfur solubility in pure copper and dilute copper-based alloys
Cited by
82 articles.
订阅此论文施引文献
订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献