Author:
Chao Pen-Shan,Huang Jung-Tang,Hsu Hou-Jun,Shih Sheng-Hsiung
Subject
Electrical and Electronic Engineering,Surfaces, Coatings and Films,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials
Reference17 articles.
1. Gheorghe Pascariu, Peter Cronin, Daniel Crowley, In: IEEE/CPMT/SEMI International Electronics Manufacturing Technology Symposium, 2003, p. 423.
2. CrCu based UBM (under bump metallization) study with electroplated Pb/63Sn solder bumps - interfacial reaction and bump shear strength
3. Formation of Pb/63Sn solder bumps using a solder droplet jetting method
4. Guo-Wei Xiao, Jing-Feng Gong, Estern W.C. Yau, Philip C.H. Chan, Ricky S.W. Lee, Matthew M.F. Yuen, In: IEEE Electronic Components and Technology Conference, 2003, p. 1850.
Cited by
5 articles.
订阅此论文施引文献
订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献