Accelerated thermo-mechanical fatigue of copper metallizations studied by pulsed laser heating-Reference-Cited by-同舟云学术

Accelerated thermo-mechanical fatigue of copper metallizations studied by pulsed laser heating

Published:2017-01 Issue: Volume:167 Page:110-118
ISSN:0167-9317
Container-title:Microelectronic Engineering
language:en
Short-container-title:Microelectronic Engineering

Author:

Wurster Stefan,Bigl Stephan,Cordill Megan J.,Kiener Daniel

Funder

Austria

Germany

The Netherlands

France

Italy

Portugal

ENIAC Joint Undertaking

Austrian Ministry for Transport, Innovation and Technology

Publisher

Elsevier BV

Subject

Electrical and Electronic Engineering,Surfaces, Coatings and Films,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials

Reference19 articles.

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2. Thermal expansion of copper from 20 to 800K—standard reference material 736;Hahn;J. Appl. Phys.,1970

3. Microplasticity phenomena in thermomechanically strained nickel thin films;Taylor;J. Mater. Sci.,2010

4. Investigation of the fatigue behavior of Al thin films with different microstructure;Heinz;Mater. Sci. Eng. A,2010

5. Advanced Characterization of thermo-mechanical fatigue mechanisms of different copper film systems for wafer metallizations;Bigl;Thin Solid Films,2016

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