Characteristics of electroplated Sn bumps fabricated without a PR mould on a Si chip for 3D packaging-Reference-Cited by-同舟云学术

Characteristics of electroplated Sn bumps fabricated without a PR mould on a Si chip for 3D packaging

Published:2012-05 Issue: Volume:93 Page:85-90
ISSN:0167-9317
Container-title:Microelectronic Engineering
language:en
Short-container-title:Microelectronic Engineering

Author:

Jun Jiheon,Lee Wanggu,Jung Jae Pil,Norman Zhou Y.

Publisher

Elsevier BV

Subject

Electrical and Electronic Engineering,Surfaces, Coatings and Films,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials

Reference20 articles.

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