Inkjetting dielectric layer for electronic applications-Reference-Cited by-同舟云学术

Inkjetting dielectric layer for electronic applications

Published:2010-10 Issue:10 Volume:87 Page:1984-1991
ISSN:0167-9317
Container-title:Microelectronic Engineering
language:en
Short-container-title:Microelectronic Engineering

Author:

Kaija Kimmo,Pekkanen Ville,Mäntysalo Matti,Koskinen Santtu,Niittynen Juha,Halonen Eerik,Mansikkamäki Pauliina

Publisher

Elsevier BV

Subject

Electrical and Electronic Engineering,Surfaces, Coatings and Films,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials

Reference10 articles.

1. R. Rönkkä, P. Mansikkamäki, M. Mäntysalo, Flexibility in inkjet and nanomaterial based electronics manufacturing business, in: Proceedings of the 16th European Microelectronics and Packaging Conference, Oulu, Finland, 2007.

2. M. Mäntysalo, P. Mansikkamäki, J. Miettinen, K. Kaija, S. Pienimaa, R. Rönkkä, K. Hashizume, A. Kamigori, Y. Matsuba, K. Oyama, N. Terada, H. Saito, M. Kuchiki, M. Tsubouchi, Evaluation of inkjet technology for electronic packaging and system integration, in: Proceedings of the 57th Electronic Components and Technology Conference, Reno, USA, 2007.

3. H. Imai, S. Mizuno, A. Makabe, K. Sakurada, K. Wada, Application of inkjet printing technology to electro packaging, in: Proceedings of the 39th International Symposium on Microelectronics, San Diego, USA, 2006.

4. Printed Organic and Molecular Electronics;Gamota,2004

5. H. Saito, Y. Matsuba, Liquid wiring technology by ink-jet printing using NanoPaste®, in: Proceedings of the 39th International Symposium on Microelectronics, San Diego, USA, 2006.

Cited by 15 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Six sigma: estrategia para el mejoramiento de procesos en el sector manufacturero;Dirección y Organización;2023-07-01

2. Post-treatment for Printed Electronics;Printed Electronics Technologies;2022-07-20

3. 3D printed electronics: Processes, materials and future trends;Progress in Materials Science;2022-06

4. 3D Printing of Multilayered and Multimaterial Electronics: A Review;Advanced Electronic Materials;2021-07-16

5. Comparative Reliability of Inkjet-Printed Electronics Packaging;IEEE Transactions on Components, Packaging and Manufacturing Technology;2021-02