Evaluation of Inkjet Technology for Electronic Packaging and System Integration-Reference-Cited by-同舟云学术

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Evaluation of Inkjet Technology for Electronic Packaging and System Integration

Published:2007-05 Issue: Volume: Page:
ISSN:
Container-title:2007 Proceedings 57th Electronic Components and Technology Conference
language:
Short-container-title:

Author:

Mantysalo Matti,Mansikkamaki Pauliina,Miettinen Jani,Kaija Kimmo,Pienimaa Seppo,Ronkka Risto,Hashizume Kenichi,Kamigori Akiko,Matsuba Yorishige,Oyama Kenshu,Terada Nobuto,Saito Hiroshi,Kuchiki Mikiharu,Tsubouchi Mikihiko

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx5/4249837/4249838/04249867.pdf?arnumber=4249867

Cited by 29 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

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2. Research of 3D Printing Technology for Polyimide Film based on Micropen Direct-writing;2022 23rd International Conference on Electronic Packaging Technology (ICEPT);2022-08-10

3. Bilayer Silver Precipitation in Glass Formed by Alternate Doping of Silver and Sodium Ions and Additive Voltage Application;Journal of the Japan Society for Precision Engineering;2021-07-05

4. Enabling Low Cost Flexible Smart Packaging System With Internet-of-Things Connectivity via Flexible Hybrid Integration of Silicon RFID Chip and Printed Polymer Sensors;IEEE Sensors Journal;2020-05-01

5. All-Printed Piezoresistive Sensor Matrix with Organic Thin-Film Transistors as a Switch for Crosstalk Reduction;ACS Applied Electronic Materials;2020-04-23

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