Through Silicon Capacitor co-integrated with TSVs on silicon interposer-Reference-Cited by-同舟云学术

Through Silicon Capacitor co-integrated with TSVs on silicon interposer

Published:2014-05 Issue: Volume:120 Page:121-126
ISSN:0167-9317
Container-title:Microelectronic Engineering
language:en
Short-container-title:Microelectronic Engineering

Author:

Guiller O.,Joblot S.,Lamy Y.,Farcy A.,Carpentier J.F.,Defay E.

Publisher

Elsevier BV

Subject

Electrical and Electronic Engineering,Surfaces, Coatings and Films,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials

Reference10 articles.

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2. J. Cain, in: 17th Capacitor and Resistor Technology Symposium, 1997, pp. 24–27.

3. L. Wan, P.M. Raj, D. Balaraman, P. Muthana, S.K. Bhattacharya, M.Varadarajan, I.R. Abothu, M. Swaminathan, R. Tummala, in: IEEE Electronics Components and Technology Conference, 2005, pp. 1617-1622.

4. P. Muthana, M. Swaminathan, E. Engin, P. M. Raj, R. Tummala, in: IEEE Electrical Performance of lectronic Packaging, 2005, pp. 271-274.

5. High-Density 3-D Capacitors for Power Systems On-Chip: Evaluation of a Technology Based on Silicon Submicrometer Pore Arrays Formed by Electrochemical Etching

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