Utilizing inkjet printing to fabricate electrical interconnections in a system-in-package-Reference-Cited by-同舟云学术

Utilizing inkjet printing to fabricate electrical interconnections in a system-in-package

Published:2010-11 Issue:11 Volume:87 Page:2382-2390
ISSN:0167-9317
Container-title:Microelectronic Engineering
language:en
Short-container-title:Microelectronic Engineering

Author:

Pekkanen Ville,Mäntysalo Matti,Kaija Kimmo,Mansikkamäki Pauliina,Kunnari Esa,Laine Katja,Niittynen Juha,Koskinen Santtu,Halonen Eerik,Caglar Umur

Publisher

Elsevier BV

Subject

Electrical and Electronic Engineering,Surfaces, Coatings and Films,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials

Reference26 articles.

1. J. Miettinen, V. Pekkanen, K. Kaija, P. Mansikkamäki, J. Mäntysalo, M. Mäntysalo, et al., Microelectronics Journal 39 (2008).

2. T. Xu, D. Albertalli, in: The Sixth International Meeting on Information Display and The International Display Manufacturing Conference Digest, August 22–25, Daegu, Korea, 2006.

3. R. Mills, G.D. Gates, S. Santana, in: Proceedings of Digital Fabrication, September 17–21, Denver, CO, USA, 2006.

4. K. Kaija, V. Pekkanen, M. Mäntysalo, P. Mansikkamäki, Microelectronics Engineering 85 (2008).

5. M. Mäntysalo, V. Pekkanen, K. Kaija, J. Niittynen, S. Koskinen, E. Halonen, et al., in: Proceedings of Electronic Components and Technology Conference (ECTC), May 26–29, San Diego, CA, USA, 2009.

Cited by 34 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Flexible/Conformal Inkjet-Printed 3-D “Ramp” Interconnects for 5G/mmWave System-on-Package Designs and Wearable Applications;IEEE Transactions on Components, Packaging and Manufacturing Technology;2024-08

2. Auto-ejection of liquid from a nozzle;Physical Review E;2024-04-08

3. Optimal Design of Droplet Ejection for PZT Printhead Based on Surrogate Model;Applied Sciences;2022-11-17

4. Aerosol Jet Printing and Interconnection Technologies on Additive Manufactured Substrates;Journal of Manufacturing and Materials Processing;2022-10-09

5. Comparative Reliability of Inkjet-Printed Electronics Packaging;IEEE Transactions on Components, Packaging and Manufacturing Technology;2021-02