Inkjet printed System-in-Package design and manufacturing

Author:

Miettinen Jani,Pekkanen Ville,Kaija Kimmo,Mansikkamäki Pauliina,Mäntysalo Juha,Mäntysalo Matti,Niittynen Juha,Pekkanen Jussi,Saviauk Taavi,Rönkkä Risto

Publisher

Elsevier BV

Subject

General Engineering

Reference20 articles.

1. Jet printing flexible displays;Street;Mater. Today,2006

2. R. Rönkkä, S. Pienimaa, P. Mansikkamäki, M. Mäntysalo, Flexibility in inkjet and nano-material based electronics manufacturing business, in: Proceeding of 16th European Microelectronics and Packaging Conference, Oulu, Finland, 17–20 June, 2007.

3. Formulation and processing of novel conductive solution inks in continuous inkjet printing of 3-D electric circuits;Mei;IEEE Trans.Electron. Packag. Manufa.,2005

4. J.C. Liou, C.H. Liu, C.J. Chen, A bubble-jet MEMS printhead integrated with CMOS de-multiplexer, in: Proceedings of IEEE Advanced Semiconductor Manufacturing Conference and Workshop 2004, 4–6 May, 2004.

5. K. Youngjae, S. Wonchul, P. Changsung, Y. Youngseuck, J. Jaewoo, O. Yongsoo, The effects of driving waveform of piezoelectric industrial inkjet head for fine patterns, in: Proceedings of the 1st IEEE International Conference on Nano/Micro Engineered and Molecular Systems, January, 18–21, 2006, Zhuhai, China.

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