Subject
Electrical and Electronic Engineering,Surfaces, Coatings and Films,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials
Reference40 articles.
1. Stripping of photoresist using a remote thermal Ar/O[sub 2] and Ar/N[sub 2]/O[sub 2] plasma
2. C. Waldfried, Q. Han, J. Kuo, in: Proceedings of Eletrochemical Society, vol. 2000–07, 2001, pp. 207–212
3. Hydrogen Plasma Removal of Post‐RIE Residue for Backend Processing
4. Challenge of ashing and cleaning on SiOC-H dielectric: characterization and main issues
5. S. Lin, C. Jin, L. Lui, M. Tsai, M. Daniels, A. Gonzalez, J.T. Wetzel, K.A. Monnig, P.A. Winebarger, S. Jang, D. Yu, M.S. Liang, in: Proceedings of the IEEE International Interconnect Technology Conference, 2001, pp. 146–148
Cited by
49 articles.
订阅此论文施引文献
订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献