Experimental and numerical investigation of low melting point metal based PCM heat sink with internal fins-Reference-Cited by-同舟云学术

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Experimental and numerical investigation of low melting point metal based PCM heat sink with internal fins

Published:2017-10 Issue: Volume:87 Page:118-124
ISSN:0735-1933
Container-title:International Communications in Heat and Mass Transfer
language:en
Short-container-title:International Communications in Heat and Mass Transfer

Author:

Yang Xiao-Hu,Tan Si-Cong,Ding Yu-Jie,Wang Lei,Liu Jing,Zhou Yi-Xin

Funder

Chinese Academy of Sciences

Tsinghua University

Publisher

Elsevier BV

Subject

Condensed Matter Physics,General Chemical Engineering,Atomic and Molecular Physics, and Optics

Reference27 articles.

1. Thermal energy storage technologies and systems for concentrating solar power plants;Kuravi;Prog. Energy Combust. Sci.,2013

2. Exergy and energy analyses of two different types of PCM based thermal management systems for space air conditioning applications;Tyagi;Energy Convers. Manag.,2013

3. Review of passive PCM latent heat thermal energy storage systems towards buildings' energy efficiency;Soares;Energy Build.,2013

4. Transient cooling of electronics using phase change material (PCM)-based heat sinks;Kandasamy;Appl. Therm. Eng.,2008

5. Thermal performance of heat spreader for electronics cooling with incorporated phase change material;Jaworski;Appl. Therm. Eng.,2011

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1. An experimental investigation into PCM-integrated heat sinks under varying duty cycles;Journal of Energy Storage;2024-09

2. Analysis of nanofluid and nano-enhanced phase change material (NEPCM) in a heat exchanger for thermal management of electronic devices;Numerical Heat Transfer, Part A: Applications;2024-07

3. Rigidity‐Tunable Materials for Soft Engineering Systems;Advanced Engineering Materials;2024-05-21

4. Numerical study and optimization of battery thermal management systems (BTMS) Based on Fin-Phase change material (PCM) in variable gravity environments;Applied Thermal Engineering;2024-05

5. Liquid metal phase change materials for thermal management of electronics;Advances in Physics: X;2024-03-11

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