An experimental study on the heat dissipation of LED lighting module using metal/carbon foam-Reference-Cited by-同舟云学术

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An experimental study on the heat dissipation of LED lighting module using metal/carbon foam

Published:2013-11 Issue: Volume:48 Page:73-79
ISSN:0735-1933
Container-title:International Communications in Heat and Mass Transfer
language:en
Short-container-title:International Communications in Heat and Mass Transfer

Author:

Yang Kai-Shing,Chung Chi-Hung,Lee Ming-Tsang,Chiang Song-Bor,Wong Cheng-Chou,Wang Chi-Chuan

Publisher

Elsevier BV

Subject

Condensed Matter Physics,General Chemical Engineering,Atomic and Molecular Physics, and Optics

Reference20 articles.

1. Solid-state lighting: failure analysis of white LEDs;Narendran;J. Cryst. Growth,2004

2. A study on the heat dissipation of high power multi-chip COB LEDs;Wu;J. Microelectron.,2012

3. High brightness GaN vertical light emitting diodes on metal alloyed substrate for general lighting application;Tran;J. Cryst. Growth,2007

4. Optimized thermal management from a chip to a heat sink for high-power GaN-based light-emitting diodes;Horng;IEEE Trans. Electron Devices,2010

5. Improvement of thermal management of high-power GaN-based light-emitting diodes;Liou;Microelectron. Reliab.,2012

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4. Cooling High-Powered LEDs Using an Innovative Fully Automated Heat Pipe System;Intelligent Manufacturing and Energy Sustainability;2023-11-28

5. Thermal resistance of Open-Cell metal foam with thermal interface materials (TIM);Applied Thermal Engineering;2023-01

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