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The heat transfer characteristics of liquid cooling heat sink with micro pin fins

  • Published:2017-08 Issue: Volume:86 Page:174-180
  • ISSN:0735-1933
  • Container-title:International Communications in Heat and Mass Transfer
  • language:en
  • Short-container-title:International Communications in Heat and Mass Transfer

Author:

Chiu Han-Chieh,Hsieh Ren-Horn,Wang Kai,Jang Jer-Huan,Yu Cheng-Ru

Funder

National Science Council

Taipei City University of Science and Technology

Publisher

Elsevier BV

Subject

Condensed Matter Physics,General Chemical Engineering,Atomic and Molecular Physics, and Optics

Reference23 articles.

1. High-performance heatsinking for VLSI;Tuckermann;IEEE Electron Device Lett.,1981

2. Microchanneled structures;Hoopman;ASME DSC,1990

3. Convective heat transfer and flow friction for water flow in microchannel structures;Peng;Int. J. Heat Mass Transf.,1996

4. Heat transfer for water flow in trapezoidal silicon microcahnnels;Qu;Int. J. Heat Mass Transf.,2000

5. Numerical optimization of the thermal performance of a microchannel heatsink;Ryu;Int. J. Heat Mass Transf.,2002

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