Heat transfer enhancement by flexible printed circuit board's deformation

Author:

Lim C.H.,Abdullah M.Z.,Azid I.A.,Khor C.Y.

Funder

Ministry of Higher Education (MOHE), Malaysia

Publisher

Elsevier BV

Subject

Condensed Matter Physics,General Chemical Engineering,Atomic and Molecular Physics, and Optics

Reference27 articles.

1. A novel fabrication process of MEMS devices on polyimide flexible substrates;Xiao;Microelectron. Eng.,2008

2. Investigation on Flexible Type Printed Circuit Board Electronics Using Fluid-Structure Interaction Technique;Leong,2014

3. Flexible PCB-MEMS flow sensor;Petropoulos;Proc. Eng.,2012

4. Fabrication and evaluation of LED-embedded ribbons for highly flexible lighting applications in rooms;Takamatsu;Microsyst. Technol.,2015

5. Study on the fluid-structure interaction of flexible printed circuit board motherboard in personal computer casings;Leong;Microelectron. Int.,2013

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3. A new environmentally friendly non-destructive activation process of electroless nickel plating on alumina ceramics;Materials Today Communications;2023-06

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