Liquid cooling in the mini-rectangular fin heat sink with and without thermoelectric for CPU

Author:

Naphon Paisarn,Wiriyasart Songkran

Publisher

Elsevier BV

Subject

Condensed Matter Physics,General Chemical Engineering,Atomic and Molecular Physics, and Optics

Reference31 articles.

1. Cooling performance of integrated thermoelectric microcooler;Gao;Solid-State Electronics,1999

2. Boiling of saturated FC-72 on square pin fin arrays;Guglielmini;International Journal of Thermal Sciences,2002

3. Analysis of microchannel heat sink for electronics cooling;Zhao;International Journal of Heat and Mass Transfer,2002

4. Effects of fin geometry on boiling heat transfer from silicon chips with micro-pin-fins immersed in FC-72;Wei;International Journal of Heat and Mass Transfer,2003

5. Optimum allocation of heat transfer surface area for cooling load and COP optimization of a thermoelectric refrigerator;Luo;Energy Conservation and Management,2003

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