Temperature-dependent inhibition of PEG in acid copper plating: Theoretical analysis and experiment evidence-Reference-Cited by-同舟云学术

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Temperature-dependent inhibition of PEG in acid copper plating: Theoretical analysis and experiment evidence

Published:2020-09 Issue: Volume:24 Page:100973
ISSN:2352-4928
Container-title:Materials Today Communications
language:en
Short-container-title:Materials Today Communications

Author:

Lai Zhiqiang,Wang Chong,Huang Yunzhong,Chen Yuanming,Wang Shouxu,Hong Yan,Zhou Guoyun,He Wei,Su Xinhong,Sun Yukai,Tao Yingguo,Lu Xiaoyan

Funder

National Natural Science Foundation of China

Sci-Tech projects of Guangdong Province

Sichuan Province

Zhuhai City

Open Foundation of State Key Laboratory of Electronic Thin Films and Integrated Devices

Publisher

Elsevier BV

Subject

Materials Chemistry,Mechanics of Materials,General Materials Science

Reference22 articles.

1. Plating uniformity of bottom-up copper pillars and patterns for IC substrates with additive-assisted electrodeposition;Chen;Electrochim. Acta,2014

2. Solvent-dependent ultrasonic surface treatment on morphological reconstruction of CuO particles for copper electrodeposition;Chen;Appl. Surf. Sci.,2019

3. Curvature enhanced adsorbate coverage mechanism for bottom-up superfilling and bump control in damascene processing;Moffat;Electrochim. Acta,2007

4. Filling mechanism in microvia metallization by copper electroplating;Dow;Electrochim. Acta,2008

5. Effects of polyethylene glycol on the electrochemical characteristics of copper cathodes in an acid copper medium;Reid;Plat. Surf. Finish.,1987

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