Effect of Si additions on mechanical properties and softening resistance of Cu–Ni-Sn-P alloy

Author:

Wan Jia,Xiao Xiang-Peng,Xiong Shu-Jun,Chen Jin-Shui,Guo Cheng-Jun

Publisher

Elsevier BV

Subject

Materials Chemistry,Mechanics of Materials,General Materials Science

Reference25 articles.

1. Microstructure and properties of Cu−2.3Fe−0.03P allo during thermomechanical treatments;Dong;Trans. Nonferrous Met. Soc. China,2015

2. The evolution of microstructure in Cu–8.0Ni–1.8Si–0.15Mg alloy during aging;Lei;Mater. Sci. Eng.,2010

3. The combination of precipitation and dispersion hardening in powder metallurgy produced Cu-Ti-Si alloy;Božića;Mater. Charact.,2008

4. Effect of Cr and Sn additions on microstructure, mechanical-electrical properties and softening resistance of Cu-Cr-Sn alloy;Li;Mater. Sci. Eng. A,2021

5. Patterns and challenges in the copper industry in China;Li;Resour., Conserv. Recycl.,2017

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