Enhanced high-temperature mechanical properties of the Cu–1.16Ni–0.36Cr alloy owing to interactions between metastable precipitates and dislocations

Author:

Li ShaolinORCID,Sun Wenming,Song Kexing,Wang Qiangsong,Zhu Yingying

Publisher

Elsevier BV

Reference30 articles.

1. Electronic Packaging: lead frame materials;Breedis,2016

2. Evolution of microstructure and residual stress for a lead-frame Cu-2.13 Fe-0.026 P (wt.%) alloy;Cao;Journal of Alloys and Compounds,2023

3. Effect of Si additions on mechanical properties and softening resistance of Cu–Ni-Sn-P alloy;Wan;Materials Today Communications,2023

4. 4H-SiC integrated circuits for high-temperature applications;Tang;Journal of Crystal Growth,2023

5. Effect of annealing temperature on dual-structure coexisting precipitates in Cu–2.18 Fe–0.03 P alloy and softening mechanism at high temperature;Zhou;Journal of Materials Science,2022

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