Author:
An Qi,An Rong,Wang Chunqing,Wang Hong
Funder
National Natural Science Foundation of China
Subject
Materials Chemistry,Mechanics of Materials,General Materials Science
Reference26 articles.
1. D. Tudryn, Carissa, Solder joint fatigue study under low temperature Martian conditions, IEEE Aerospace Conference, Big Sky, Montana, March 4–11, 2006.
2. Measurement of mechanical properties of electronic materials at temperatures down to 4.2 K;Fink;Cryogenics,2008
3. J. Blanche et al., Reliability of flip chip assemblies subjected to extreme low temperatures, Thermal and Thermomechanical Proceedings 10th Intersociety Conference on Phenomena in Electronics Systems, 2006. ITHERM 2006., 2006, pp. 1379–1389. https://doi.org/10.1109/ITHERM.2006.1645506.
4. H.B. Garrett, I. Jun, A.A. Shapiro, Interstellar Space Missions: Ultra-reliability requirements and engineering issues, Proceedings of 45th AIAA Aerospace Sciences Meeting and Exhibit, 2007, No. AIAA 2007–501. https://doi.org/10.2514/6.2007–501.
5. Mechanical properties and fracture mechanisms of Sn-3.0Ag-0.5Cu solder alloys and joints at cryogenic temperatures;Tian;Mater. Sci. Eng. A,2017
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