Author:
Wang Y.,Enachescu M.,Cotofana S.D.,Fang L.
Subject
Electrical and Electronic Engineering,Surfaces, Coatings and Films,Safety, Risk, Reliability and Quality,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials
Reference14 articles.
1. McPherson JW. Reliability challenges for 45nm and beyond. In: Proceedings of the 43rd annual design automation conference, DAC ’06; 2006. p. 176–81.
2. Reddy V, Krishnan A, Marshall E. Impact of negative bias temperature instability on digital circuit reliability. In: 40th Reliability physics symposium proceedings; 2002. p. 248 – 54.
3. Srinivasan J, Adve S, Bose P, Rivers J. The case for lifetime reliability-aware microprocessors. In: Proceedings of the 31st annual international symposium on computer architecture; 2004. p. 276 – 87.
4. Blome JA, Feng S, Gupta S, Mahlke SA. Self-calibrating online wearout detection. In: MICRO; 2004. p. 109–22.
5. Zhuo C, Sylvester D, Blaauw D. Process variation and temperature-aware reliability management. In: Design, automation test in europe conference exhibition (DATE); 2010. p. 580 –85.
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