Author:
Kar Yap Boon,Hui Tan Cai,Agileswari Ramasamy,Lo Calvin
Subject
Electrical and Electronic Engineering,Surfaces, Coatings and Films,Safety, Risk, Reliability and Quality,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials
Reference18 articles.
1. Zheng Y, Hillman C, McClusky P. Intermetallic growth on PWBs soldered with Sn3.8Ag0.7Cu. A. James Clark School of Engineering, University of Maryland; 2002.
2. Queck Kian Pin, Heitzer Ludwig, Yong Wei Wei. 2nd Level reliability drop test robustness for wafer level packages. In: IEEE 34th International electronic manufacturing technology conference; 2010.
3. NXP semiconductors. Electromigration in WLCSP solder bumps. R.L.J.M Ubachs/Microelectronics Reliability. The Netherlands; 2010.
4. Wang Yen-Ping, Hung Liang Yi, Chang Chiang Cheng, Wang Yu-Po, Hsiao C.S. Board level reliability study for CSP with polymer cored solder ball. In: IEEE Microsystems, Packaging, Assembly & Circuits Technology Conference, 3rd, International, 2008.
5. Varia Ronak, Fan Xuejun. Reliability enhancement of wafer level packages with nano-column-like hollow solder ball structures. In: IEEE Electronic Components and Technology Conference; 2011.
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